School of microelectronics, Fudan University
sjding@fudan.edu.cn
04, 2008 - Now, Fudan University, Researcher
01, 2005 - 03, 2008, Fudan University, Associate Researcher
02, 2003 - 12, 2004, National university of Singapore, Research Fellow
10, 2001 - 11, 2002, Keele university (Germany), Humboldt scholars, Germany (post-doctor)
School of microelectronics, Fudan University
wjliu@fudan.edu.cn
07, 2022 - Now, Fudan University, Researcher
07, 2015 - 06, 2022, Fudan University, Young Researcher
10, 2012 - 06, 2015, University of Tokyo, JSPS Research Fellow
04, 2009 - 10, 2012, Nanyang Technological University, Singapore, Research Fellow
School of microelectronics, Fudan University, microelectronics and solid-state electronics (2009), Doctor
School of microelectronics, Fudan University
wuxiaohan@fudan.edu.cn
12, 2024 - Now, Fudan University, Researcher
09, 2018 - 11, 2024, Fudan University, Associate Researcher
09, 2013 - 08, 2018, Tongji University, Assistant Researcher
First University of Montpellier, France, Doctor
School of microelectronics, Fudan University
wjliu@fudan.edu.cn
07, 2022-Now, Fudan University, Young Associate Researcher
04, 2019-07, 2022, National Integrated Circuit Innovation Center, Minister of R&D Department
04, 2017-03, 2019, Fudan University, Post-doctor
04, 2016-03, 2017, PDF Solutions, Inc., Data Analysis Engineer
08, 2013-10, 2013, Leibniz Institute for Solid State Materials, Germany, Visiting Scholar
School of microelectronics, Fudan University, microelectronics and solid-state electronics, Doctor
Received his Bachelor degree in Material Science and Engineering from Tongji University, Shanghai, in 2021
Received his Bachelor degree in Material Science and Engineering from Tongji University, Shanghai, in 2022
Received her Bachelor degree in Materials Science and Engineering from Tongji University, Shanghai,in 2023
Received her Master degree in Integrated Circuit Engineering from Xidian University, Xi'an, in 2023.
Received his Bachelor degree in Materials Science and Engineering from Tongji University, Shanghai,in 2024
Received his Master degree in Electronic and Information Engineering from Fudan University, Shanghai,in 2024
Received his Bachelor degree in Radio Wave Propagation and Antennas from University of Electronic Science and Technology of China, Sichuan,in 2025
Received his Bachelor degree in Microelectronics Science and Engineering from Shanghai University，Shanghai,in 2024
