School of microelectronics, Fudan University
sjding@fudan.edu.cn
04, 2008 - Now, Fudan University，Researcher
01, 2005 - 03, 2008, Fudan University，Associate Researcher
02, 2003 - 12, 2004, National university of Singapore，Research Fellow
10, 2001 - 11, 2002, Keele university（Germany），Humboldt scholars, Germany (post-doctor)
School of microelectronics, Fudan University
wjliu@fudan.edu.cn
07, 2015 - Now, Fudan University, Young Researcher
10, 2012 - 06, 2015, University of Tokyo, JSPS Research Fellow
04, 2009 - 10, 2012, Nanyang Technological University, Singapore, Research Fellow
School of microelectronics, Fudan University, microelectronics and solid-state electronics (2009), Doctor
School of microelectronics, Fudan University
wuxiaohan@fudan.edu.cn
09, 2018 - Now, Fudan University, Associate Researcher
09, 2013 - 08, 2018, Tongji University, Assistant Researcher
First University of Montpellier, France, biomedical materials and devices, Doctor
School of microelectronics, Fudan University
wjliu@fudan.edu.cn
07，2022-Now，Fudan University，Young Associate Researcher
04，2019-07，2022，National Integrated Circuit Innovation Center, Minister of R&D Department
04，2017-03，2019，Fudan University，Post-doctor
04，2016-03，2017，PDF Solutions, Inc.，Data Analysis Engineer
08，2013-10，2013，Leibniz Institute for Solid State Materials，Germany，Visiting Scholar
School of microelectronics, Fudan University, microelectronics and solid-state electronics, Doctor
Received his Bachelor degree in Material Science and Engineering from Tongji University, Shanghai, in 2020
Received his Bachelor degree in Material Science and Engineering from Tongji University, Shanghai, in 2021
Received his Bachelor degree in Material Science and Engineering from Tongji University, Shanghai, in 2022
Received her Bachelor degree in Materials Science and Engineeringfrom Tongji University, Shanghai,in 2023
